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JXQ SERIES Diamond wire slicing machine


Equipment Brief JXQ SERIES Diamond wire slicing machine is the special precision equipment for wafer slicing in solar energy industry. Is the production of solar cells before operation (ingot, square root, slice) in production costs accounted for the largest and highest technical difficulty of equipment.It adopts SIEMENS full servo control system, multi-shaft linkage control to realize stable and high precision slicing and produce the wafer which meet the requirement of cell production.

Equipment Brief

JXQ SERIES Diamond wire slicing machine is the special precision equipment for wafer slicing in solar energy industry. Is the production of solar cells before operation (ingot, square root, slice) in production costs accounted for the largest and highest technical difficulty of equipment.It adopts SIEMENS full servo control system, multi-shaft linkage control to realize stable and high precision slicing and produce the wafer which meet the requirement of cell production.


Item

JXQ600

Workpiece species

 Sapphire、 compound、SiC、etc。

Workpiece size

156X600X2

Slicing cycle

8

Wafer quantity single cut

3450

Workbench max. stroke

230

Workbench speed

0~2.5

Max. wire speed

16

Wire tension

15~25

Wire diameter

0.11~0.16

Wire guiding wheel diameter

300

Wire guiding wheel shaft pitch

520

Wire storage capacity

500~900

Mortar tank capacity

320

Machine size

2200X4400X3500

Machine weight

14


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